A-WBP-D005EA-11SR01

Headers, Male Pins Overview

The A-WBP-D005EA-11SR01 is a board-to-board connector header manufactured by Assmann WSW Components. It features an 11-position configuration with a 1.25 mm pitch. The component utilizes surface mount technology and is designed in a right-angle package orientation. This specific wafer series part supports a current rating of 1A, ensuring reliable electrical connectivity for compact electronic assemblies requiring dense pin arrangements.

Headers, Male Pins Feature Summary

• Surface mount right-angle design
• 11-position 1.25mm pitch configuration
• Wafer series construction

Headers, Male Pins Applications

• Board-to-board interconnections
• Compact electronic device assembly
• High-density circuit board integration

Headers, Male Pins Procurement Notes

Verify the exact suffix against official manufacturer documentation to confirm pin count and pitch specifications. Ensure compatibility with mating headers from the same D005 series family. Confirm RoHS compliance status through certified datasheets prior to procurement to meet regulatory requirements.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle surface mount solution is required for 1.25mm pitch applications. The 11-pin configuration suits designs needing moderate I/O density within restricted vertical space constraints. Validate mechanical fitment against PCB layout guidelines for right-angle headers.

Headers, Male Pins Part Context

This part belongs to the D005 wafer series of board-to-board connectors. It represents a specialized surface mount option within Assmann's connector portfolio, focusing on high-density interconnects. The series is characterized by its small form factor and reliability in consumer electronics manufacturing environments.

Headers, Male Pins Replacement Considerations

Consult official substitution lists for equivalent 11-pin, 1.25mm pitch SMT right-angle headers. Verify that any alternative maintains identical current ratings and mechanical dimensions to ensure seamless integration without redesigning the PCB footprint.