A-WBP-O001DG-06SR01

Headers, Male Pins Overview

The A-WBP-O001DG-06SR01 is a wire-to-board wafer connector manufactured by Assmann WSW Components. It features a 6-position configuration with a 3.00mm pitch. The component is designed for surface mount or through-hole integration, facilitating reliable electrical connections between cables and printed circuit boards in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Utilizes a wafer-style connector design for secure wire-to-board interfacing
• Supports 6-position connectivity with standardized 3.00mm spacing
• Engineered for robust signal transmission in dense circuit layouts

Headers, Male Pins Applications

• Wire-to-board interconnections
• Consumer electronics assembly
• Industrial control modules

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix to ensure correct pin count and pitch compatibility. Confirm RoHS compliance status prior to integration. Check manufacturer documentation for updated lifecycle status, as lead times may vary based on production schedules and regional availability constraints.

Headers, Male Pins Selection Notes

Select this component when a 6-position connection is required at a 3.00mm interval. Ensure mating connectors match the wafer style and terminal type. Validate mechanical fit within the designated PCB footprint and verify current rating requirements against application loads before finalizing the bill of materials.

Headers, Male Pins Part Context

This part belongs to Assmann WSW's rectangular power and signal connector portfolio. The series focuses on standard and custom-tailored solutions for flat cable and wire applications. It supports system integration needs across various industrial and commercial sectors requiring reliable interconnectivity.

Headers, Male Pins Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify pinout and mechanical dimensions against potential alternatives to ensure functional equivalence without redesigning the host PCB layout.