SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ABCC95 is a bonding cable clamp manufactured by nVent HOFFMAN, designed for securing EMC shielded cables. Constructed from steel with a zinc-plated finish, this component provides reliable mechanical retention and electrical grounding continuity. It is specifically engineered to accommodate cables with a diameter of approximately 0.37 inches (9.5 mm). The clamp belongs to the A80 series and is RoHS compliant, ensuring adherence to environmental standards for restricted hazardous substances in electronic equipment manufacturing.
Verify that the required cable diameter matches the 0.37-inch specification before procurement. Confirm that the zinc-plated steel material is suitable for the intended environmental conditions. Ensure the part is sourced as a genuine nVent HOFFMAN product to guarantee compliance with RoHS directives and proper dimensional tolerances for the A80 series mounting systems.
Select this component when a dedicated bonding clamp is required for shielded cabling rather than general strain relief. Consider the steel material and zinc plating for standard indoor or mild industrial environments. Verify compatibility with the specific enclosure model and available mounting space within the A80 series framework.
This item is an accessory within the nVent HOFFMAN enclosure ecosystem, specifically supporting the A80 series. It functions as a critical grounding interface for shielded cables entering or exiting metal enclosures. The product supports the brand's focus on protecting sensitive electronics from contaminants while maintaining electrical integrity in industrial settings.
No direct public substitute part numbers are documented for this specific bonding clamp configuration.

Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More