SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ADPX4CLG is an external data pocket manufactured by Hoffman Enclosures, Inc., designed for use with Type 4, 4X, and 12 enclosures. Constructed from steel with a light gray powder-coated finish, it measures 12-1/4 inches in height, 18 inches in width, and 3-1/4 inches in depth (approximately 311mm x 457mm x 83mm). This accessory provides a dedicated space for storing documentation or labels on the exterior of industrial electrical enclosures.
Verify compatibility with specific enclosure models before procurement. Confirm that the required NEMA rating (Type 4, 4X, or 12) matches the primary enclosure system. Ensure the steel construction and light gray finish align with environmental requirements and aesthetic standards for the installation site.
Select this component when external documentation storage is required for NEMA 4, 4X, or 12 rated enclosures. The steel construction offers robustness suitable for indoor industrial environments. Consider the 18-inch width for accommodating larger manuals or schematics compared to standard narrow pockets.
This part belongs to the nVent HOFFMAN InterSafe A80DP series of external accessories. It is designed to enhance the functionality of Hoffman's standard line of metal enclosures by adding organizational capabilities without compromising the protective rating of the main housing unit.
No direct public substitute part numbers are confirmed for this specific model number.

Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More