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Product Detailed Parameters
- Description:LED GREEN ROUND 4SMD
- Series:-
- Mfr:Broadcom Limited
- Package:Tape & Reel (TR),Cut Tape (CT)
- Color:Green
- Configuration:-
- Lens Color:Green
- Lens Transparency:-
- Millicandela Rating:36000mcd
- Lens Style:Round with Domed Top
- Lens Size:-
- Voltage - Forward (Vf) (Typ):2.8V
- Current - Test:20mA
- Viewing Angle:15°
- Mounting Type:Surface Mount
- Wavelength - Dominant:525nm
- Wavelength - Peak:516nm
- Features:-
- Package / Case:4-SMD, Gull Wing
- Supplier Device Package:4-SMD
- Size / Dimension:4.20mm L x 4.20mm W
- Height (Max):7.00mm
- Grade:-
- Qualification:-
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Overview
The ALMD-CM1F-34002 is a green surface-mount LED from Broadcom Limited. It features an InGaN chip with a round, domed lens and a 15-degree viewing angle. The peak wavelength is 516nm, with a dominant wavelength of 525nm. Typical forward voltage is 2.8V at a test current of 20mA. Intensity reaches 36,000mcd. Moisture sensitivity level is 2A.
Feature Summary
- High-intensity green light emission suitable for visual indicators
- Compact surface-mount design with a round domed lens profile
- Narrow 15-degree beam angle for focused illumination
Applications
- Panel status indicators
- Equipment front-panel signaling
- Consumer electronics status lights
Procurement Notes
Verify the complete part number including suffixes to ensure correct wavelength and intensity specifications. Confirm RoHS compliance and moisture sensitivity handling requirements during storage and assembly. Cross-reference datasheet electrical parameters against system power supply constraints before integration.
Selection Notes
Select this component when high brightness in a compact form factor is required. The narrow viewing angle suits applications needing directed light. Ensure thermal management aligns with the specified forward voltage and current limits. Consider mechanical footprint compatibility with PCB layout constraints.
Part Context
This device belongs to Broadcom's discrete LED portfolio designed for general indication purposes. It utilizes standard semiconductor packaging technologies optimized for automated surface-mount assembly processes. The product line focuses on providing reliable optical performance within strict dimensional tolerances for modern electronic assemblies.
Replacement Considerations
Consult official documentation for direct substitutes. Verify spectral output and physical dimensions match application requirements when considering alternative components.
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