Memory IC AS4C128M16D3L-12BCNTR product image

AS4C128M16D3L-12BCNTR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:ad8486ca4259 Category: Brand:

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AS4C128M16D3L-12BCNTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 2GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C128M16D3L-12BCNTR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-TFBGA
  • Supplier Device Package:96-FBGA (9x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C128M16D3L-12BCNTR

AS4C128M16D3L-12BCNTR

Memory IC Overview

The AS4C128M16D3L-12BCNTR is a DDR3L SDRAM component manufactured by Alliance Memory, Inc. It features a storage capacity of 2 Gbit organized as 128 M x 16 bits with a 16-bit data bus width. The device supports a maximum clock frequency of 800 MHz and has an access time of 225 ps. Operating voltage ranges from 1.283 V to 1.45 V. It utilizes a 96-ball FBGA package suitable for surface mount technology. The commercial temperature range spans from 0°C to +95°C. Maximum power supply current is specified at 80 mA.

Memory IC Feature Summary

  • Supports low-voltage operation within the DDR3L specification range
  • Provides high-speed synchronous interface capabilities up to 800 MHz
  • Utilizes a compact 96-ball FBGA surface-mount package format

Memory IC Applications

  • General-purpose digital logic systems requiring volatile memory
  • Embedded computing platforms utilizing DDR3L interfaces
  • Consumer electronics devices compatible with commercial temperature grades

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm the tape and reel packaging configuration. Ensure that the ordering information matches the exact electrical characteristics and thermal grade required for the target application environment. Cross-reference the part number with authorized distributor catalogs to validate current availability status and lead times prior to finalizing procurement plans.

Memory IC Selection Notes

Select this component when a 2 Gbit density with a 16-bit interface width is required for DDR3L applications. Consider the 96-ball FBGA package dimensions for PCB layout constraints. Evaluate the commercial temperature range suitability against the operational environment requirements. Confirm compatibility with system voltage levels falling within the specified 1.283 V to 1.45 V operating window.

Memory IC Part Context

This dynamic random-access memory belongs to the Alliance Memory DDR3L product family. It serves as a volatile storage solution designed for modern electronic systems needing efficient data retention without power. The component integrates standard DDR3L protocols for broad compatibility with contemporary memory controllers and system architectures.

Memory IC Replacement Considerations

Consult official substitution guides for verified equivalent parts. Verify pinout compatibility and electrical parameter alignment before considering alternative manufacturers or densities.

AS4C128M16D3L-12BCNTRAS4C128M16D3L-12BCNTR

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