Memory IC AS4C128M32MD2-18BIN product image

AS4C128M32MD2-18BIN

  • Description:IC DRAM 4GBIT PARALLEL 134FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray

SKU:410d1837a840 Category: Brand:

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AS4C128M32MD2-18BIN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 4GBIT PARALLEL 134FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C128M32MD2-18BIN

  • Description:IC DRAM 4GBIT PARALLEL 134FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR2
  • Memory Size:4Gbit
  • Memory Organization:128M x 32
  • Memory Interface:Parallel
  • Clock Frequency:533 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.14V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:134-VFBGA
  • Supplier Device Package:134-FBGA (10x11.5)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C128M32MD2-18BIN

AS4C128M32MD2-18BIN

Memory IC Overview

The AS4C128M32MD2-18BIN is a mobile LPDDR2 SDRAM manufactured by Alliance Memory. It provides a total storage capacity of 4 Gbit, organized as 128M x 32 bits. The device supports a maximum clock frequency of 533 MHz and features an access time of 18 ns. It operates within a voltage range of 1.14 V to 1.95 V and is housed in a 134-ball FBGA package measuring 10x11.5 mm. Designed for industrial temperature ranges, it offers high bandwidth for mobile applications.

Memory IC Feature Summary

  • Mobile LPDDR2 architecture optimized for low power consumption
  • High-speed parallel interface supporting up to 533 MHz
  • Industrial temperature rating for robust environmental operation
  • Compact 134-ball FBGA package design

Memory IC Applications

  • Smartphones and mobile communication devices
  • Portable consumer electronics requiring high memory bandwidth
  • Industrial control systems with mobile form factors
  • Medical equipment utilizing compact memory solutions

Memory IC Procurement Notes

Verify the specific suffix BIN against official datasheets to confirm package dimensions and thermal characteristics. Confirm availability status as distribution channels may list discontinued or limited stock items. Ensure compatibility with host controller LPDDR2 interfaces before integration into final designs.

Memory IC Selection Notes

Select this component when a 4 Gbit density with a 32-bit data bus width is required for mobile platforms. Consider the 134-ball FBGA footprint for PCB layout constraints. Evaluate the 1.14 V to 1.95 V operating range against system power rails. Verify industrial temperature specifications if deployment involves extreme environmental conditions.

Memory IC Part Context

This part belongs to the Alliance Memory AS4C series of synchronous DRAMs. It utilizes LPDDR2 technology to balance performance and power efficiency. The series targets mobile and embedded markets where space and energy conservation are critical design parameters.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes within the same manufacturer's portfolio. Verify electrical equivalence for voltage and timing parameters. Consult official cross-reference lists for validated alternative part numbers.

AS4C128M32MD2-18BINAS4C128M32MD2-18BIN

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