AS4C32M32MD1-5BIN

Memory IC Overview

The AS4C32M32MD1-5BIN is a 1 Gbit Low Power DDR SDRAM manufactured by Alliance Memory, Inc. It features a 32-bit data bus width and operates at a maximum clock frequency of 200 MHz. The device utilizes a 90-ball FBGA package and supports an industrial temperature range from -40°C to +85°C. Electrical specifications include a minimum supply voltage of 1.7 V and a maximum of 1.95 V, with a typical access time of 5 ns. This component is designed for mobile applications requiring high density and low power consumption.

Memory IC Feature Summary

• Supports Low Power DDR (LPDDR) interface for reduced energy usage in mobile devices
• High-density 1 Gbit storage capacity organized as 64M x 32 bits
• Industrial temperature rating ensures reliable operation in harsh environments
• Compact 90-ball FBGA package suitable for space-constrained designs

Memory IC Applications

• Mobile phones and smartphones
• Tablets and portable computing devices
• Digital cameras and camcorders
• Automotive infotainment systems

Memory IC Procurement Notes

Verify the exact part number against official Alliance Memory datasheets to confirm pinout and electrical characteristics. Ensure compatibility with system voltage requirements of 1.7V to 1.95V. Check for moisture sensitivity levels and reflow soldering profiles if applicable. Confirm availability status as components may be subject to discontinuation or long lead times.

Memory IC Selection Notes

Select this component when a 1 Gbit LPDDR memory solution is required for mobile or automotive applications. It offers a balance of performance and power efficiency with a 200 MHz clock speed. Consider the 90-ball FBGA package size for PCB layout constraints. Verify that the operating temperature range meets the specific environmental conditions of the target application.

Memory IC Part Context

This part belongs to the AS4C32M32MD1 series of Low Power DDR SDRAMs from Alliance Memory. It is designed to replace older SDRAM solutions in mobile devices where power consumption and board space are critical factors. The series provides high-density memory options for modern handheld electronics.

Memory IC Replacement Considerations

Check for direct pin-to-pin replacements within the same Alliance Memory LPDDR family. Verify equivalent capacity, bus width, and voltage specifications before substituting with other manufacturers' parts.