AS7C38096A-10BIN

Memory IC Overview

The AS7C38096A-10BIN is an asynchronous static random-access memory (SRAM) integrated circuit manufactured by Alliance Memory. It provides a storage capacity of 8 Mbit, organized as 1 Megabit by 8 bits. The device features a maximum access time of 10 ns and operates on a parallel interface. It supports a supply voltage range from 2.7 V to 3.6 V with a maximum power current of 110 mA. Designed for industrial applications, it functions within a temperature range of -40°C to +85°C. The component is housed in a 48-ball TFBGA surface-mount package.

Memory IC Feature Summary

• Asynchronous operation with fast 10 ns access times for rapid data retrieval
• Industrial-grade reliability across extended temperature ranges
• Single 3.3V power supply compatibility for simplified system design

Memory IC Applications

• Industrial control systems requiring robust memory performance
• Embedded systems operating in harsh environmental conditions
• Data acquisition modules needing fast random access capabilities

Memory IC Procurement Notes

Verify the specific suffix BIN against official datasheets to confirm the 48-ball TFBGA package configuration, as suffixes often denote distinct physical footprints or testing grades. Ensure the procurement documentation explicitly states the industrial temperature rating (-40°C to +85°C) to distinguish it from commercial variants. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and traceability before finalizing orders.

Memory IC Selection Notes

Select this component when designing systems that require high-speed asynchronous SRAM within strict industrial thermal constraints. The 10 ns access speed suits applications demanding quick response times without complex clock synchronization. Consider the 48-ball TFBGA package for compact board layouts where space efficiency is critical compared to larger TSOP packages.

Memory IC Part Context

This part belongs to the AS7C38096A series of high-density SRAMs. It shares architectural similarities with other members like the AS7C38096A-10TIN but differs in packaging. While the TIN variant uses a TSOP-II form factor, the BIN designation indicates a ball grid array solution, offering different thermal and mechanical integration properties for modern surface-mount assembly processes.

Memory IC Replacement Considerations

AS7C38096A-10TIN offers identical electrical specifications but utilizes a TSOP-II-44 package instead of TFBGA-48.