AUIRFN8405TR

Single FETs, MOSFETs Overview

The AUIRFN8405TR is an automotive-grade N-channel enhancement mode MOSFET manufactured by Infineon Technologies. It utilizes silicon technology and is housed in a PQFN-8 surface-mount package. The component meets the AEC-Q101 qualification standard for automotive applications. Key electrical parameters include a maximum drain-source voltage of 40 V, a continuous drain current of 120 A at case temperature, and a maximum power dissipation of 163 W at case temperature. The device supports a junction operating temperature range from -55°C to 175°C.

Single FETs, MOSFETs Feature Summary

• Automotive grade reliability certified under AEC-Q101 standards
• High thermal performance with 175°C junction temperature capability
• Low on-resistance design for efficient power switching

Single FETs, MOSFETs Applications

• Automotive power distribution systems
• Load switching in vehicle electronics
• DC-DC converter circuits

Single FETs, MOSFETs Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific datasheet revision matches the production batch requirements. Ensure storage conditions adhere to moisture sensitivity level guidelines for the PQFN-8 package. Check for any end-of-life notifications or discontinuation notices prior to finalizing procurement plans.

Single FETs, MOSFETs Selection Notes

Select this component when designing automotive circuits requiring robust N-channel switching with a 40V rating. The PQFN-8 package offers a compact footprint suitable for space-constrained PCB layouts. Consider the 120A current capacity and thermal characteristics for high-power load management applications within the specified temperature range.

Single FETs, MOSFETs Part Context

This part belongs to Infineon's portfolio of automotive power MOSFETs designed for high-reliability environments. It represents a solution for managing power in modern vehicles where efficiency and durability are critical. The PQFN-8 packaging provides a balance between thermal dissipation and board space optimization compared to larger traditional packages.