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AUIRFU4292 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N CH 250V 9.3A IPAK. Review the specifications below when checking this part for your BOM.
AUIRFU4292 is an automotive-grade N-channel HEXFET power MOSFET in the I-Pak (TO-251AA) package. It features a 250V drain-source breakdown voltage and a typical on-resistance of 275mΩ at VGS=10V, with a maximum of 345mΩ. The device supports a continuous drain current of 9.3A at 25°C case temperature and handles pulsed currents up to 40A. It operates within a junction temperature range of -55°C to +175°C, offering fast switching characteristics and repetitive avalanche capability.
Verify the specific ordering suffix 'U' corresponds to the I-Pak tube packaging configuration before procurement. Confirm that the component status aligns with project timelines, as availability may be subject to manufacturer lifecycle notices. Ensure design compatibility with the TO-251AA footprint and soldering requirements specified in the datasheet application notes.
Select this component when a robust N-channel MOSFET with 250V blocking capability is required for automotive environments. The I-Pak package suits applications needing moderate current handling with space constraints. Evaluate thermal management needs against the junction-to-ambient resistance values provided for PCB mounting conditions to ensure safe operating area compliance during continuous and pulsed operations.
The AUIRFU4292 belongs to the AUIRFR/U4292 family of automotive power MOSFETs manufactured by Infineon Technologies. It shares electrical specifications with the D-Pak variant (AUIRFR4292) but utilizes the I-Pak (TO-251AA) surface-mount package. This family is designed to meet stringent automotive quality standards while providing efficient power switching solutions.
The AUIRFR4292 serves as a direct functional equivalent with identical electrical parameters, differing only in the D-Pak package form factor. Verify pinout compatibility and thermal dissipation differences between the I-Pak and alternative packages before substitution.
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