RF Amplifiers BGA9H1BN6327XTSA1 product image

BGA9H1BN6327XTSA1

$0.55
  • Description:IC AMP 4G/5G 2.3GHZ-2.7GHZ TSNP6
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:05192d0d1670 Category: Brand:

  
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BGA9H1BN6327XTSA1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC AMP 4G/5G 2.3GHZ-2.7GHZ TSNP6. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for BGA9H1BN6327XTSA1

  • Description:IC AMP 4G/5G 2.3GHZ-2.7GHZ TSNP6
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency:2.3GHz ~ 2.7GHz
  • P1dB:5dBm
  • Gain:21.8dB
  • Noise Figure:0.6dB
  • RF Type:4G, 5G
  • Voltage - Supply:1.1V ~ 3.3V
  • Current - Supply:5.5mA
  • Test Frequency:2.6GHz
  • Mounting Type:Surface Mount
  • Package / Case:6-XFDFN
  • Supplier Device Package:PG-TSNP-6-10
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for BGA9H1BN6327XTSA1

BGA9H1BN6327XTSA1

RF Amplifiers Overview

The BGA9H1BN6327XTSA1 is a silicon-based RF MMIC general-purpose amplifier manufactured by Infineon Technologies. It operates within a frequency range of 2.3 GHz to 2.7 GHz and utilizes a TSNP-6-10 surface-mount package. The device provides a typical gain of 20.3 dB with a noise figure of 0.6 dB. It functions on a supply voltage between 1.1 V and 3.3 V, drawing a current of 2.2 mA. Key performance metrics include a P1dB compression point of -17 dBm and an OIP3 of -7 dBm. The component supports an operating temperature range from -40°C to +85°C.

RF Amplifiers Feature Summary

  • Integrated silicon RF MMIC design for compact circuit implementation
  • Low noise figure specification suitable for sensitive receiver front-ends
  • Wide single-supply voltage operational range for flexible power integration

RF Amplifiers Applications

  • Wireless communication systems requiring low-noise amplification
  • RF signal processing in mobile devices
  • General-purpose RF amplification in industrial equipment

RF Amplifiers Procurement Notes

Verify the specific ordering suffix and RoHS compliance status directly with the manufacturer or authorized distributors before procurement. Confirm that the TSNP-6-10 package dimensions align with your PCB footprint requirements. Ensure that the supply voltage and current specifications match your system's power budget constraints. Check for any recent lifecycle updates or end-of-life notices associated with this part number.

RF Amplifiers Selection Notes

Select this component when a low noise figure and moderate gain are required within the 2.3 GHz to 2.7 GHz band. Consider the 2.2 mA current consumption against your power efficiency targets. Evaluate the -17 dBm P1dB limit to ensure it meets your linearity requirements for the intended signal levels. Compare the TSNP-6-10 package size against available board space constraints.

RF Amplifiers Part Context

This part belongs to Infineon's portfolio of silicon-based radio frequency monolithic microwave integrated circuits (MMICs). These components are designed to provide high-performance amplification in a small form factor. The BGA9 series typically targets applications where space is limited but consistent RF performance is critical. This specific model focuses on general-purpose amplification tasks within defined frequency bands.

RF Amplifiers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

BGA9H1BN6327XTSA1BGA9H1BN6327XTSA1
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