SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CBPA086 is an aluminum bottom plate manufactured by Hoffman Enclosures, Inc. It measures 800 mm in width and 600 mm in depth. The component features a powder-coated finish and is designed for use with outdoor aluminum floor-standing enclosures.
Verify the specific enclosure model compatibility before procurement. Confirm that the required dimensions match the 800 mm by 600 mm specification. Ensure the powder-coated finish meets environmental protection requirements for the intended installation site. Check official documentation for any specific mounting hardware requirements associated with this base plate.
Select this part when a durable aluminum base is required for outdoor floor-standing applications. The powder coating provides corrosion resistance suitable for exterior environments. Ensure the chosen enclosure system is compatible with the 800x600 mm footprint. Verify that the material properties meet structural load requirements for the installed equipment.
This component belongs to the Hoffman Enclosures product line, specifically categorized under box components. It serves as a foundational element for larger enclosure assemblies rather than a standalone protective housing. The design supports modular construction for industrial control or distribution applications requiring robust outdoor protection.
No public confirmed substitute part numbers are available.

A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
Understand voltage controlled oscillator tuning, phase noise and PLL operation. Check supply noise, output loading and requirements before selection.
Read More
Choose a reed relay for signal switching. Understand hot and cold switching, leakage, contact resistance, isolation and measurement settling requirements.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More