CD4724BCN

Latches Overview

The CD4724BCN is an 8-bit addressable latch in a 16-lead Plastic Dual-In-Line (PDIP) package. It features three address inputs (A0–A2), an active low enable input (E), an active high clear input (CL), a data input (D), and eight outputs (Q0–Q7). The device operates within a supply voltage range of 3.0V to 15V DC and supports an operating temperature range from -55°C to +125°C.

Latches Feature Summary

• Supports serial-to-parallel conversion and storage register functions
• Enables random, addressable data entry via dedicated address lines
• Provides active high demultiplexing capability for channel selection

Latches Applications

• Serial to parallel data conversion circuits
• Storage registers in digital systems
• Random addressable data entry applications
• Active high demultiplexing configurations

Latches Procurement Notes

Verify the specific package designation matches the required form factor. Confirm that the component meets the necessary environmental standards for the intended application. Ensure compatibility with existing logic families regarding voltage levels and fan-out requirements before finalizing procurement decisions.

Latches Selection Notes

Select this component when an 8-bit latching solution with independent addressability is required. Consider the wide supply voltage range and noise immunity characteristics for robust operation. Evaluate the propagation delay specifications against system timing constraints to ensure signal integrity across all operating conditions.

Latches Part Context

This part belongs to the CD4724BC series, which includes both 8-bit addressable latches and dual 4-bit variants. The 'N' suffix specifically denotes the 16-lead PDIP package, distinguishing it from surface-mount options like the SOIC variant. This family provides versatile control over data storage and routing in complex digital architectures.

Latches Replacement Considerations

The CD4724BCM serves as a direct pin-compatible alternative utilizing a 16-Lead Small Outline Integrated Circuit (SOIC) package. Verify mechanical fitment and thermal dissipation capabilities when transitioning between through-hole and surface-mount technologies.