SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CP5255 is a painted steel panel designed for nVent HOFFMAN C2 series enclosures. It measures 52 inches in width and 55 inches in height, providing a surface area of approximately 2860 square inches (18451 cm²). The component is constructed from steel with a painted finish, intended to serve as the front or rear access door for compatible Concept HMI enclosure frames.
Verify that the target enclosure belongs to the nVent HOFFMAN C2 series before procurement. Confirm that the required opening dimensions match the 52 x 55 inch specification exactly. Ensure the mounting interface aligns with the specific Concept HMI frame design to guarantee proper fitment and structural integrity during installation.
Select this part only when utilizing nVent HOFFMAN C2 series Concept HMI enclosures. The 52 x 55 inch size is specific to this product line; verify against alternative series such as A42T or MAS which use different mounting patterns and dimensions. Ensure the steel construction meets environmental requirements for the installation site.
This component is an accessory panel within the nVent HOFFMAN enclosure portfolio. It complements the C2 series Concept HMI enclosures by providing the necessary external covering. Unlike standalone boxes like the MAS series, it functions as a replaceable or supplementary element for larger modular cabinet structures.
No direct substitute part numbers are publicly documented for this specific dimension and series combination. Verify compatibility with existing C2 series frames rather than seeking cross-model replacements.

TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Select a DC-DC converter by input range, topology, isolation and temperature. Compare ripple, efficiency and load limits before choosing a component.
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More