CYV15G0403DXB-BGXC

Telecom Overview

The CYV15G0403DXB-BGXC is a second-generation Independent Clock Quad HOTLink II Transceiver manufactured by Cypress Semiconductor. It supports signaling rates from 195 to 1500 MBaud per serial link, with an aggregate throughput of up to 12 Gbits/second. The device features four independent byte-wide channels, each capable of operating at different signaling rates and transporting distinct data types. It includes selectable 8B/10B encoding/decoding, internal phase-locked loops (PLLs), and dual differential PECL-compatible serial inputs and outputs per channel. The component operates on a single 3.3V supply, consumes approximately 3W typically, and is housed in a 256-ball thermally enhanced BGA package.

Telecom Feature Summary

• Supports multiple standards including ESCON, DVB-ASI, SMPTE-292M, SMPTE-259M, Fibre Channel, Gigabit Ethernet, and CPRI.
• Features truly independent channels allowing different signaling rates and data types per channel.
• Includes MultiFrame Receive Framer for bit and byte alignment with comma or Full K28.5 detect capabilities.
• Integrates Built-In Self-Test (BIST) hardware for at-speed link testing across transmit and receive sections.

Telecom Applications

• Multi-protocol routers requiring diverse serial interface standards.
• Aggregation equipment handling mixed data rates.
• Switches utilizing independent clock domains for various channels.

Telecom Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to ensure compatibility with required compliance standards such as SMPTE-259M/292M. Confirm package availability and lead times through authorized distributors, as this component may be subject to limited supply or end-of-life status depending on the manufacturing date code.

Telecom Selection Notes

Select the CYV15G0403DXB variant specifically when SMPTE-259M and SMPTE-292M pathological test compliance is required. Choose the CYW15G0403DXB if OBSAI-RP3 compliance and operation up to 1540 MBaud are necessary. Ensure the system design accommodates the 256-ball BGA package requirements and provides adequate thermal management for the typical 3W power consumption.

Telecom Part Context

This component belongs to the HOTLink II family, extending the original HOTLink technology with higher integration and faster data rates while maintaining serial-link compatibility. It serves as a point-to-point or point-to-multi-point communications building block for high-speed serial links over optical fiber, copper cables, or circuit board traces.

Telecom Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Designers should consult official replacement guides or contact the manufacturer for obsolescence management strategies.