D1611PM3BDGVIW-U

Memory IC Overview

The Kingston D1611PM3BDGVIW-U is a Low Power DRAM (LPDDR4) component with a total die density of 16 Gbits. It features a dual-die, dual-channel configuration organized as 1024M x 16 bits per channel. The device supports a maximum data rate of 4266 Mbps and utilizes a 200-ball FBGA package. Electrical specifications include a core supply voltage (VDD1) range of 1.70V to 1.95V and I/O buffer voltages (VDD2/VDDQ) ranging from 1.06V to 1.17V. It operates within an industrial temperature range of -40°C to +95°C.

Memory IC Feature Summary

• Dual-die architecture supporting two independent channels for concurrent operation
• Low power consumption capabilities with programmable driver strength and auto-refresh modes
• Supports Partial Array Self-Refresh (PASR) and Auto Temperature Compensated Self-Refresh (ATCSR)
• Double-data-rate interface utilizing differential clock inputs and bi-directional data strobes

Memory IC Applications

• Mobile computing platforms requiring high bandwidth and low power
• Industrial embedded systems operating in extended temperature environments
• Smartphone and tablet memory subsystems
• IoT devices and wearables with space constraints

Memory IC Procurement Notes

Verify the specific speed grade and temperature rating against system requirements before procurement. Confirm that the 200-ball FBGA footprint matches the PCB design. Ensure compatibility with the host controller's LPDDR4 interface timing parameters. Check for RoHS compliance documentation if required by regional regulations.

Memory IC Selection Notes

Select this part when a 16Gb capacity with dual-channel support is needed for industrial temperature ranges. Compare against single-channel variants if channel independence is not required. Consider the 4266 Mbps speed grade for higher bandwidth applications compared to lower-speed alternatives in the same package family.

Memory IC Part Context

This component belongs to the Kingston LPDDR4 discrete memory family designed for mobile and embedded applications. It shares the 200-ball FBGA form factor with other densities and configurations in the series. The 'VI' suffix indicates the 4266 Mbps speed grade, while 'W' denotes the industrial temperature extension.

Memory IC Replacement Considerations

Direct substitutes include D1611PM3BDGUI-U for standard temperature or B3221PM3BDGVIW-U for identical electrical characteristics but different internal organization verification.