Memory IC D5116AN9CXGRK-U product image

D5116AN9CXGRK-U

$4.31
  • Description:IC DRAM 8GBIT 96FBGA
  • Series:-
  • Mfr:Kingston Technology
  • Package:Tray

SKU:4fde9af5cb08 Category: Brand:

  
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D5116AN9CXGRK-U is listed in the Memory IC range at ChipApex. The manufacturer field lists Kingston Technology. Its product description is IC DRAM 8GBIT 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for D5116AN9CXGRK-U

  • Description:IC DRAM 8GBIT 96FBGA
  • Series:-
  • Mfr:Kingston Technology
  • Package:Tray
  • Memory Type:-
  • Memory Format:DRAM
  • Technology:SDRAM - DDR4
  • Memory Size:8Gbit
  • Memory Organization:512M x 16
  • Memory Interface:-
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.2V
  • Operating Temperature:0°C ~ 95°C
  • Mounting Type:Surface Mount
  • Package / Case:96-FBGA
  • Supplier Device Package:96-FBGA (7.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for D5116AN9CXGRK-U

D5116AN9CXGRK-U

Memory IC Overview

Kingston Technology D5116AN9CXGRK-U is an 8 Gbit DDR4 SDRAM with a 512M x 16 organization. It operates at a data rate of 2666 Mbps with CL-tRCD-tRP timings of 19-19-19. The device uses a 96-ball FBGA package and supports 8 internal banks. Supply voltages are VDD/VDDQ at 1.2V ±0.06V and VPP at 2.5V (+0.25/-0.125V). Operating temperatures range from 0°C to +95°C for commercial applications.

Memory IC Feature Summary

  • Supports Double Data Rate architecture with 8-bit prefetch pipelining for high-speed data transfer.
  • Features differential clock inputs and edge-aligned data strobes for precise timing alignment.
  • Includes programmable burst lengths, dynamic on-die termination, and asynchronous reset functionality.
  • Provides write cycle redundancy code support and command/address parity checking.

Memory IC Applications

  • Embedded systems requiring compact memory solutions
  • Industrial automation controllers
  • Telecommunications infrastructure equipment

Memory IC Procurement Notes

Verify the specific speed bin and temperature rating against system requirements before procurement. Confirm that the 96-ball FBGA package dimensions match the PCB footprint design. Ensure power supply rails meet the strict voltage tolerances specified in the datasheet to guarantee reliable operation.

Memory IC Selection Notes

Select this component when a 16-bit data bus width is required for embedded designs. The 2666 Mbps speed bin suits applications where moderate bandwidth meets cost constraints. Verify compatibility with the host controller's DDR4 interface specifications regarding bank grouping and refresh rates.

Memory IC Part Context

This part belongs to Kingston's embedded discrete DRAM family designed for device manufacturers. It complements other density variants like the D1028 series. The product line focuses on low-voltage operation and compliance with RoHS directives for modern electronic infrastructures.

Memory IC Replacement Considerations

D5116AN9CXGXN-U offers identical specifications but operates at a higher 3200 Mbps speed bin. D5116AN9CXGXNI-U provides industrial temperature range capability (-40°C to +95°C) compared to the commercial range of the GRK variant.

D5116AN9CXGRK-UD5116AN9CXGRK-U
$4.31
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