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DG202BDY-T1-E3 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is IC SWITCH SPST-NOX4 85OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The DG202BDY-T1-E3 is a quad single-pole single-throw (SPST) CMOS analog switch manufactured by Vishay Siliconix. It operates with a supply voltage range of ±4.5 V to ±22 V or a single supply from +4.5 V to +25 V. The device features a maximum on-resistance of 85 Ω at room temperature and up to 200 Ω across the full operating temperature range. Switching times are specified with a maximum turn-on time of 300 ns and a maximum turn-off time of 200 ns. It utilizes a 16-pin narrow SOIC package and supports an extended industrial temperature range from -40 °C to +85 °C.
Verify the specific suffix 'T1' indicates reel packaging and '-E3' confirms RoHS compliance when sourcing this component. Confirm that the narrow SOIC-16 footprint matches the target PCB layout requirements. Ensure the procurement channel provides traceability for the Vishay Siliconix manufacturing origin, as specifications may vary slightly between qualified production sites.
Select the DG202BDY-T1-E3 when a normally open switch configuration is required, distinguishing it from the DG201B counterpart which is normally closed. Evaluate the 85 Ω on-resistance against signal integrity needs in the application circuit. Consider the 300 ns switching speed sufficient for the intended data rates and ensure the ±22 V rating accommodates the maximum expected analog signal swing.
This component belongs to the DG201B/DG202B series, representing improved versions of the industry-standard DG201A and DG202 devices. The B-series offers lower on-resistance, reduced leakage current, faster switching speeds, and lower power consumption compared to previous generations while maintaining compatibility with standard logic interfaces.
The DG202BDQ-T1-E3 serves as a direct functional substitute utilizing a TSSOP-16 package instead of the narrow SOIC-16 form factor. Designers must verify pin-to-pin compatibility and adjust PCB footprints accordingly when transitioning between these package types.
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