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DG419CY+T is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SWITCH SPDT X 1 35OHM 8SOIC. Review the specifications below when checking this part for your BOM.
The DG419CY+T is a single-channel SPST analog switch manufactured by Analog Devices Inc. under the Maxim Integrated brand, housed in an 8-SOIC surface-mount package. It operates on a single supply voltage ranging from 10 V to 30 V or dual supplies of ±4.5 V to ±20 V. The device features a maximum on-resistance of 35 ohms and supports a continuous DC switch current of 30 mA. Electrical specifications include a maximum turn-on time of 175 ns and a turn-off time of 145 ns. Power dissipation is rated at 471 mW, with a maximum supply current of 1 uA. The component functions within a temperature range of 0°C to +70°C.
Verify the specific suffix 'CY+T' against official manufacturer documentation to confirm the SOIC-8 tape-and-reel packaging and industrial temperature grade. Ensure compatibility with existing PCB footprints and reflow soldering profiles. Cross-reference RoHS compliance status with current regulatory requirements before finalizing procurement orders.
Select this component when a single-pole single-throw configuration is required with moderate on-resistance. The SOIC-8 package suits automated surface-mount assembly processes. Verify that the 30 mA continuous current rating meets load requirements. Consider thermal management for the 471 mW power dissipation limit in enclosed designs.
This part belongs to the DG419 series of improved SPST/SPDT analog switches. It shares core electrical characteristics with through-hole variants like the DG419CJ+, differing primarily in package type and mounting style. The series utilizes LC2MOS technology to balance speed and power efficiency.
DG419CJ+ offers identical electrical performance in a PDIP-8 through-hole package. ADG419 provides similar specifications under the Analog Devices branding. Verify pinout compatibility and thermal resistance differences when substituting between package types.
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