DSA60C60HB

Diode Arrays Overview

The DSA60C60HB is a silicon Schottky diode manufactured by Littelfuse, formerly IXYS. It features a dual anode common cathode configuration housed in a TO-247-3 through-hole package. Key electrical parameters include a maximum repetitive reverse voltage of 60 V and a continuous forward current of 60 A. The device exhibits a typical forward voltage of 930 mV and a maximum reverse current of 500 nA. It supports a forward surge current of 260 A and operates within a temperature range of -55 C to +175 C.

Diode Arrays Feature Summary

• Dual anode common cathode configuration for bridge rectifier applications
• Silicon Schottky technology for low forward voltage drop
• High thermal stability with extended operating temperature range

Diode Arrays Applications

• DC-DC converters
• Free-wheeling rectification in power supplies
• Inverter circuits

Diode Arrays Procurement Notes

Verify the manufacturer designation as Littelfuse, which completed the acquisition of IXYS. Confirm the specific suffix HB corresponds to the standard tube packaging and pinout configuration. Ensure the component meets RoHS and REACH SVHC compliance requirements for the intended market. Cross-reference the datasheet revision to confirm parameter consistency before integration into final designs.

Diode Arrays Selection Notes

Select this component when a dual Schottky configuration is required for high-current applications. The 60 A rating and 60 V breakdown voltage suit low-voltage, high-efficiency power conversion stages. The TO-247-3 package facilitates efficient heat dissipation compared to smaller form factors. Consider the forward voltage characteristics for thermal management calculations in dense circuit layouts.

Diode Arrays Part Context

This component belongs to the DSA60C60 series of Gen2 Schottky diodes. The series is designed for general-purpose rectification where low loss and fast switching are critical. The product line utilizes advanced silicon processes to enhance reliability and performance under high thermal stress conditions typical in industrial power electronics.

Diode Arrays Replacement Considerations

Check for direct substitutes within the same DSA60C60 family or equivalent ratings from other manufacturers. Verify pin compatibility and thermal resistance values when considering alternative packages. Ensure that any replacement maintains the dual anode common cathode topology to fit existing board footprints.