SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman Enclosures E4PBGXM is a steel pushbutton enclosure designed for indoor use. It features a gray finish and measures 9.5 inches in length, 2.75 inches in width, and 3.5 inches in depth (241.3 mm x 69.85 mm x 88.9 mm). The unit provides NEMA Type 12 and IP65 protection ratings against dust, dirt, oil, and water. It includes four outlets specifically sized to accommodate 22.5 mm deep pushbuttons and switches. The cover is hinged and secured with captivated screws that thread into sealed wells.
Verify the specific model suffix and manufacturer designation when sourcing, as nVent Hoffman products may be listed under various distributor codes. Confirm that the required back panel is ordered separately, as it is not included with the enclosure body. Ensure compatibility with 22.5 mm component depths before procurement.
Select this model for applications requiring protection against dust, dirt, and oil splashes in indoor environments. It is suitable for mounting components with a maximum depth of 22.5 mm. Verify that the physical dimensions fit within the available panel space and that the NEMA 12 rating meets the facility's environmental requirements.
This part belongs to the Hoffman E series extra deep pushbutton enclosures. These units are engineered to provide robust housing for control devices while maintaining a compact footprint. The series emphasizes durability through welded construction and secure fastening mechanisms to ensure long-term reliability in industrial settings.
Check for equivalent models from nVent Hoffman or other manufacturers offering NEMA 12/IP65 rated steel enclosures with four 22.5 mm outlets. Ensure dimensional compatibility and mounting hole patterns match existing installations.

TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More