SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The EKSS20104-316 is a floor-standing enclosure manufactured by nVent Hoffman. It features a compact design constructed from AISI 316L stainless steel, providing high corrosion resistance and ingress protection rated IP66. The unit measures 2000 mm in height, 1000 mm in width, and 400 mm in depth. It includes a single opaque door, a removable rear panel, and a bottom plate. The body and rear panel utilize 1.5 mm material thickness, while the door is 2 mm thick.
Verify the specific material grade (AISI 316L) against project requirements to ensure compatibility with corrosive environments. Confirm dimensional constraints fit the intended installation space. Check for included accessories such as mounting plates or hinges. Ensure the IP66 rating meets environmental protection needs. Validate that the single-door configuration aligns with maintenance access requirements.
Select this model when high corrosion resistance is critical due to the use of 316L stainless steel. Consider the floor-standing form factor for applications where wall mounting is not feasible. The IP66 rating makes it suitable for wet or dusty environments. Evaluate the 2000x1000x400 mm dimensions to ensure adequate internal volume for equipment. Verify that the single-door design provides sufficient access for operational needs.
This part belongs to the nVent HOFFMAN EKSS series of stainless steel compact floor-standing enclosures. The series is designed to offer high impact and ingress protection alongside very high corrosion protection. The EKSS20104-316 variant specifically utilizes 316L stainless steel, distinguishing it from standard 304 steel models within the same product line.
EKSS20104 is the 304 stainless steel equivalent within the same series. EKSS20104-316 may be substituted for EKSS20104 if enhanced corrosion resistance is required. Verify dimensional compatibility between variants before replacement.
Wilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More