SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ESFC316 is a full-height swing frame manufactured by Hoffman Enclosures, Inc., designed for integration into steel, combinable, and compact enclosure systems. Constructed from mild steel, this component supports 19-inch components and facilitates left or right-hand door opening configurations. The unit features hinges engineered to provide extra build-in depth, with an adjustable top hinge ensuring square mounting alignment within the enclosure structure.
Verify that the specific application requires a mild steel swing frame rather than stainless steel alternatives. Confirm that the enclosure system is compatible with the specified hinge depth and mounting requirements. Ensure that the 19-inch component width matches the frame specifications before procurement.
Select this model when a full-height swing frame is required for 19-inch equipment installation. Consider the mild steel construction for standard indoor or protected environments where corrosion resistance is not the primary constraint. Verify compatibility with existing enclosure frames regarding hinge depth and mounting adjustments.
This part belongs to the Hoffman Enclosures product line, which specializes in industrial enclosures and rack accessories. The manufacturer provides various enclosure types including stainless steel options with NEMA 4X ratings. This swing frame serves as a structural accessory for organizing internal components within larger enclosure assemblies.
No public confirmed substitute part numbers are available.

Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More