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FOD3182TSV is listed in the Isolators - Gate Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISO 5KV 1CH GATE DVR 8SMD. Review the specifications below when checking this part for your BOM.
The FOD3182TSV is a high-speed MOSFET gate driver optocoupler manufactured by onsemi. It features a single channel with a photodarlington output type, delivering a maximum continuous output current of 3 A. The device operates within an insulation voltage of 5000 Vrms and supports surface-mount installation in an SMT-8 package. Key electrical parameters include a forward current of 10 mA, a forward voltage of 1.43 V, and a reverse voltage of 5 V. Power dissipation is rated at 295 mW. The unit exhibits a rise time of 38 ns and a fall time of 24 ns. It functions reliably across a temperature range from -40 C to +100 C.
Verify the specific suffix 'TSV' corresponds to the required tape-and-reel packaging configuration. Confirm that the SMT-8 footprint matches the target PCB design. Ensure the 3 A output current rating meets the load requirements. Check compliance with RoHS directives if applicable. Validate the operating temperature range against environmental conditions.
Select this component when high-speed isolation combined with significant drive current is required. The 3 A output capability distinguishes it from standard logic-output optocouplers. Consider the 5000 Vrms isolation rating for safety-critical applications. Evaluate the 38 ns rise time for compatibility with switching frequencies. Compare power dissipation limits against thermal management capabilities.
This part belongs to the FOD3182 series of high-speed optocouplers designed for power electronics. It serves as a bridge between low-voltage control logic and high-power switching devices. The series emphasizes speed and drive strength to minimize switching losses in inverters and converters.
Check datasheets for equivalent parts offering similar 3 A output current and high-speed characteristics. Verify pinout compatibility for direct replacement. Ensure isolation voltage and package dimensions match existing designs.
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