Diode Arrays FST16035 product image

FST16035

$68.03
  • Description:DIODE MOD SCHOT 35V 160A TO249AB
  • Series:-

SKU:fa49f95ac1cf Category: Brand:

  
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FST16035 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOT 35V 160A TO249AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for FST16035

  • Description:DIODE MOD SCHOT 35V 160A TO249AB
  • Series:-
  • Mfr:GeneSiC Semiconductor
  • Package:Bulk
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):35 V
  • Current - Average Rectified (Io) (per Diode):160A
  • Voltage - Forward (Vf) (Max) @ If:750 mV @ 160 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:1 mA @ 20 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:TO-249AB
  • Supplier Device Package:TO-249AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for FST16035

FST16035

Diode Arrays Overview

The GeneSiC Semiconductor FST16035 is a silicon power Schottky diode housed in a TO-249AB package. It features an average forward current rating of 160 A per package and a repetitive peak reverse voltage of 35 V. The device supports a maximum instantaneous forward surge current of 1000 A per leg with a thermal resistance from junction to case of 0.50 °C/W per leg. Operating temperatures range from -55 °C to 150 °C.

Diode Arrays Feature Summary

  • High surge capability for robust transient handling
  • Isolated terminal configuration for flexible mounting

Diode Arrays Applications

  • High frequency rectification in switching mode power supplies
  • Freewheeling diode applications in DC-to-DC converters
  • Polarity protection circuits

Diode Arrays Procurement Notes

Verify the specific part number against official datasheets to confirm electrical ratings and package dimensions. Ensure compatibility with required thermal management solutions given the junction-to-case thermal resistance specifications. Confirm that the isolated plate design aligns with system grounding requirements before finalizing procurement.

Diode Arrays Selection Notes

Select this component when high average current capacity and low forward voltage drop are critical for efficiency. The TO-249AB package facilitates effective heat dissipation through direct mounting. Consider the 35 V reverse voltage rating to ensure adequate margin over operating voltages while maintaining low leakage characteristics typical of Schottky technology.

Diode Arrays Part Context

This component belongs to the FST160xx series of silicon power Schottky diodes, which includes variants with different reverse voltage ratings such as 20 V, 30 V, and 40 V. All members of this series share the same 160 A average forward current rating and utilize the TO-249AB package form factor for consistent mechanical integration.

Diode Arrays Replacement Considerations

Compatible substitutes within the same series include the FST16020 (20 V), FST16030 (30 V), and FST16040 (40 V). Verify that the alternative voltage rating meets or exceeds the circuit's maximum reverse voltage requirements without compromising performance.

Diode Arrays FAQ

What is the thermal resistance from junction to case?

The thermal resistance from junction to case is 0.50 °C/W per leg.

Is the device sensitive to electrostatic discharge?

No, the FST16035 is not ESD sensitive.

FST16035FST16035
$68.03
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