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HB4015HLT is listed in the Pulse Transformers range at ChipApex. The manufacturer field lists Pulse Electronics. Its product description is MOD SIN 2.5GPP 1:1 HF SMD. Review the specifications below when checking this part for your BOM.
The HB4015HLT is a LAN discrete module manufactured by Pulse Electronics, designed for high-frequency surface-mount applications. It features a dual-channel configuration with a 1:1 turns ratio and supports data rates up to 2.5 Gbps for LAN 2.5G Base-T networks. The component incorporates Power over Ethernet (PoE) capabilities and provides an insulation voltage of 1.5 kVrms. It operates within a temperature range of 0°C to +70°C. The physical dimensions are approximately 117.55 mm in length and 6 mm in height, utilizing a standard SMD package suitable for automated assembly processes.
Verify the specific manufacturer part number against official Pulse Electronics documentation to ensure compatibility with design requirements. Confirm that the surface-mount package dimensions and pinout align with the intended PCB layout. Check for any recent updates to RoHS compliance or environmental certifications required for the target market. Ensure that the operating temperature range meets the thermal constraints of the final application environment before finalizing procurement decisions.
Select this component when designing systems requiring 2.5 Gigabit Ethernet connectivity with integrated PoE support. The dual-channel architecture simplifies board layout compared to discrete transformer solutions. Consider the physical footprint and mounting type to ensure it fits within the mechanical constraints of the enclosure. Evaluate the insulation voltage rating against the safety standards applicable to the end product's deployment region.
This component belongs to the LAN transformer category from Pulse Electronics, specifically tailored for datacom applications. It serves as a critical interface element between the Ethernet PHY chip and the external cabling infrastructure. The module consolidates multiple magnetic functions into a single surface-mount package, reducing component count and assembly complexity in modern networking equipment designs.
Public confirmed substitute part numbers are not available in the provided source material.
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