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HF2024-622Y1R0-T01 is listed in the Common Mode Chokes range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is CMC 1A 2LN TH. Review the specifications below when checking this part for your BOM.
The HF2024-622Y1R0-T01 is a common mode choke manufactured by TDK Corporation. It features a vertical through-hole mounting style with four pins and an unshielded design. The component supports two lines and handles a maximum DC current of 1A. Key electrical specifications include an inductance of 6.2 mH, a maximum DC resistance of 500 mOhms, and an impedance rating. It operates within a temperature range of -20°C to 120°C.
Verify the part number HF2024-622Y1R0-T01 against official TDK documentation to confirm specifications such as 1A current rating and 6.2 mH inductance. Ensure the vertical 4-pin package matches your board layout requirements. Check RoHS compliance status if required by your manufacturing standards. Confirm the operating temperature range of -20°C to 120°C suits your environmental conditions.
Select this component when a 1A current rating and 6.2 mH inductance are required for common mode noise reduction. The vertical through-hole package is suitable for boards supporting this mounting type. Consider the unshielded nature if magnetic interference from adjacent components is a concern. Verify that the 500 mOhm DC resistance meets your power loss constraints.
This component belongs to the HF series of common mode chokes from TDK Corporation. The series offers various inductance and current ratings for different filtering needs. The HF2024-622Y1R0-T01 specifically targets applications requiring robust noise suppression in a through-hole format. It is designed for reliability in industrial and consumer electronics environments.
Consult TDK's official cross-reference tools or distributor databases for verified substitutes. Ensure any replacement maintains the 1A current rating, 6.2 mH inductance, and vertical 4-pin package dimensions. Verify compatibility with existing PCB footprints and thermal requirements before substitution.
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