IDT71V546XS133PF

Memory IC Overview

The IDT71V546XS133PF is a 3.3V high-speed synchronous SRAM with a 4.5 Megabit capacity organized as 128K x 36 bits. It features Zero Bus Turnaround (ZBT) technology to eliminate dead bus cycles between read and write operations. The device supports a maximum clock frequency of 133 MHz with a 4.2 ns clock-to-data access time. It utilizes a single 3.3V power supply and is packaged in a JEDEC standard 100-pin TQFP.

Memory IC Feature Summary

• Zero Bus Turnaround eliminates dead cycles during bus turnaround between reads and writes
• Internally synchronized registered outputs remove the need for external Output Enable control
• On-chip burst counter supports four-word interleaved or linear burst sequences
• Single Read/Write control pin simplifies interface logic

Memory IC Applications

• High-performance system memory buffers
• Fully pipelined application data storage
• Systems requiring rapid read/write cycle transitions

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to potential availability issues. Confirm package integrity and pin alignment prior to assembly. Ensure voltage levels match the specified 3.3V ±5% requirement. Check for moisture sensitivity handling requirements before soldering. Validate that the specific speed grade matches system timing constraints.

Memory IC Selection Notes

Select this component for applications demanding high-speed synchronous data transfer without bus turnaround latency. The 128K x 36 organization suits wide data path requirements. Consider the 100-pin TQFP package for board density constraints. Verify compatibility with single 3.3V supply systems. Evaluate the pipelined output architecture for system synchronization needs.

Memory IC Part Context

This part belongs to the IDT71V546 series of ZBT Synchronous SRAMs. It is manufactured by Renesas Electronics Corporation, formerly Integrated Device Technology. The series is designed for commercial and industrial temperature ranges. It represents a solution for high-density memory applications requiring fast access times.

Memory IC Replacement Considerations

Check for direct pin-compatible alternatives from the same manufacturer family. Verify electrical specifications such as access time and voltage levels. Ensure the replacement supports the required burst mode and ZBT functionality. Confirm package dimensions match the existing footprint.