IDT71V67602S133BQ

Description：IC SRAM 9MBIT PARALLEL 165CABGA
Series：-
Mfr：Renesas Electronics Corporation
Package：Tray

SKU:022f19260c3d Category: Memory IC Brand: Renesas Electronics Corporation

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Product introduction

IDT71V67602S133BQ is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 9MBIT PARALLEL 165CABGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IDT71V67602S133BQ

Description：IC SRAM 9MBIT PARALLEL 165CABGA
Series：-
Mfr：Renesas Electronics Corporation
Package：Tray
Memory Type：Volatile
Memory Format：SRAM
Technology：SRAM - Synchronous, SDR
Memory Size：9Mbit
Memory Organization：256K x 36
Memory Interface：Parallel
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：3.135V ~ 3.465V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：165-TBGA
Supplier Device Package：165-CABGA (13x15)
Access Time：4.2 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for IDT71V67602S133BQ

IDT71V67602S133BQ

Memory IC Overview

The IDT71V67602S133BQ is a synchronous single data rate static random-access memory integrated circuit manufactured by Renesas Electronics Corporation. It provides a total storage capacity of 9 Megabits, organized as 256K words by 36 bits. The device supports parallel interface operations with a maximum clock frequency of 133 MHz and features an access time of 4.2 nanoseconds. It operates within a supply voltage range of 3.135V to 3.465V and is designed for surface mount installation in a 165-CABGA package measuring 13x15 millimeters.

Memory IC Feature Summary

Supports high-speed synchronous parallel data transfer at frequencies up to 133 MHz
Provides 36-bit wide data organization for efficient system integration
Operates on a standard 3.3V power supply rail

Memory IC Applications

High-performance computing systems requiring fast memory access
Network infrastructure equipment
Telecommunications hardware

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm pinout compatibility and electrical specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to procurement. Ensure the selected variant matches the required operating temperature range and packaging format for the target application design.

Memory IC Selection Notes

Select this component when a 36-bit data width is required for system bus alignment. Consider the 165-CABGA package constraints for PCB layout and thermal management. Evaluate the 4.2 ns access time against system timing requirements to ensure adequate performance margins for the intended synchronous operation speed.

Memory IC Part Context

This part belongs to the IDT 71V67602 family of synchronous SRAM devices. The family offers various speed grades and package options to accommodate different performance and form factor requirements. The S133 suffix indicates the 133 MHz speed bin, while BQ denotes the specific 165-pin CABGA package configuration used in this variant.