JS27HU2G08SDDA-25-SU

Memory IC Overview

The JS27HU2G08SDDA-25-SU is a 2 Gbit NAND Flash memory device manufactured by Jeju Semiconductor Corp. It features an x8 I/O interface and operates within a supply voltage range of 2.7 V to 3.6 V. The component utilizes a 63-Ball FBGA package measuring 9.0 mm by 11.0 mm with a height of 1.0 mm. It supports ONFI 1.0 compliant command sets and includes hardware data protection mechanisms. The device provides 128 bytes of spare area per page and is rated for industrial operating temperatures ranging from -40°C to 85°C.

Memory IC Feature Summary

• Supports copy-back program operations for fast data rewriting without external buffering
• Includes internal ECC engine providing 4-bit error correction capability
• Features hardware write protection against unintended modify operations during power transitions
• Offers cache read functionality to improve overall read throughput

Memory IC Applications

• Solid state mass storage applications
• Industrial embedded systems requiring extended temperature ranges
• Consumer electronics utilizing NAND flash interfaces
• Automotive Grade 2 electronic control units

Memory IC Procurement Notes

Verify the specific ordering suffix 'SU' corresponds to the standard industrial grade configuration as documented in the official datasheet. Confirm that the required voltage supply aligns with the 2.7 V to 3.6 V specification for the HU series. Ensure compatibility with the 63-ball FBGA footprint dimensions during PCB layout verification.

Memory IC Selection Notes

Select this component when an x8 interface width is required for the 2 Gbit density level. Consider the 128-byte spare area size if designing systems dependent on specific ECC overhead allocations. Verify that the system controller supports the ONFI 1.0 command set for proper initialization and operation sequences.

Memory IC Part Context

This part belongs to the JSC NAND Series, which offers densities from 1 Gbit to 8 Gbit. The series maintains pinout compatibility across different densities, facilitating easy migration between storage capacities without rearranging the physical footprint. The device architecture supports multi-plane operations for higher performance requirements.

Memory IC Replacement Considerations

Consult the manufacturer's official documentation for verified substitute part numbers. Cross-reference specifications such as voltage range, interface width, and package dimensions before considering alternative components.