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LM2576D2T-3.3 is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists onsemi. Its product description is IC REG BUCK 3.3V 3A D2PAK-5. Review the specifications below when checking this part for your BOM.
The LM2576D2T-3.3 is a monolithic integrated circuit providing step-down (buck) switching regulator functions, manufactured by onsemi in the D2PAK-5 package. It delivers a fixed 3.3V output with a guaranteed maximum current of 3A. The device operates with an input voltage range up to 40V and utilizes a 52kHz fixed-frequency internal oscillator. Key electrical specifications include a typical standby current of 50µA, ±4% output voltage tolerance under specified conditions, and a junction temperature operating range from -40°C to +125°C.
Verify the specific suffix 'D2T' against the manufacturer's official datasheet to confirm the exact tape-and-reel packaging configuration and quantity per reel. Ensure the part number matches the required D2PAK-5 surface-mount variant. Cross-reference the revision level to guarantee compatibility with intended PCB footprints and thermal management requirements.
Select this component when a fixed 3.3V output is required without external feedback resistors. It serves as a direct replacement for legacy three-terminal linear regulators where higher efficiency and reduced heat sink size are priorities. Suitable for designs requiring robust over-current and thermal protection within a compact surface-mount footprint.
This device belongs to the LM2576 series of SIMPLE SWITCHER power controllers. The series is characterized by its ability to drive heavy loads with excellent line and load regulation while requiring minimal external support components. It represents a standard solution for medium-power DC-DC conversion applications in industrial and consumer electronics.
The LM2576S-3.3 and LM2576T-3.3 offer identical electrical performance but utilize TO-263 and TO-220 packages respectively. Verify pinout compatibility and thermal dissipation characteristics before substituting different package types in existing designs.
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