M20-9991446

Headers, Male Pins Overview

The Harwin M20-9991446 is a vertical pin header from the M20 series, featuring 14 positions with a 2.54 mm (0.1 in) pitch. It utilizes a single row configuration designed for through-hole mounting with a straight installation angle. The connector employs solder pin termination and features gold high temperature plating on male pins. It operates within a temperature range of -40°C to +105°C.

Headers, Male Pins Feature Summary

• Gold high temperature plating ensures reliable electrical contact performance under elevated thermal conditions.
• Single row vertical design facilitates straightforward board-to-board or cable interconnections.
• Through-hole solder pin termination provides secure mechanical attachment to printed circuit boards.

Headers, Male Pins Applications

• Board-to-board interconnections
• Cable to board connections

Headers, Male Pins Procurement Notes

Verify component authenticity by cross-referencing the manufacturer part number against official Harwin documentation. Confirm that the gold high temperature plating specification matches project requirements. Ensure the single row through-hole package aligns with existing PCB footprint designs before finalizing procurement decisions.

Headers, Male Pins Selection Notes

Select this component when high-temperature stability is required due to its gold plating finish. The 2.54 mm pitch suits standard spacing applications. Verify that the 14-position count meets circuit density needs. Consider the through-hole mounting style for robust mechanical retention compared to surface mount alternatives.

Headers, Male Pins Part Context

This component belongs to the Harwin M20 series of headers and wire housings. The series offers various position counts and plating options. The M20-9991446 specifically addresses applications requiring durable gold contacts in a single-row vertical format.

Headers, Male Pins Replacement Considerations

Consult official Harwin substitution guides for verified equivalents. Generic substitutes may lack the specific gold high temperature plating characteristics essential for thermal reliability.