M2S005S-FGG484

Soc System On Chip Overview

The M2S005S-FGG484I is a SmartFusion 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 microcontroller subsystem and 6K logic elements. It operates with a core voltage of 1.2V (±5%) and supports I/O voltages ranging from 1.2V to 3.3V. The device is housed in a 484-pin FineLine BGA package and supports commercial temperature grades (0°C to 85°C) and industrial grades (-40°C to 100°C). Key specifications include embedded flash memory, SRAM, and high-speed serial interfaces.

Soc System On Chip Feature Summary

• Integrates an ARM Cortex-M3 processor with the FPGA fabric for real-time control
• Contains 6K Logic Elements (LEs) for digital logic implementation
• Supports multiple I/O standards including LVCMOS, LVDS, and SSTL
• Features embedded non-volatile memory (eNVM) for configuration storage

Soc System On Chip Applications

• Industrial automation controllers requiring mixed-signal processing
• Secure embedded systems utilizing hardware-based security features
• Communication gateways leveraging integrated SerDes interfaces
• Test and measurement equipment needing low-power reconfigurable logic

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' corresponds to the required industrial temperature grade (-40°C to 100°C) as defined in the datasheet operating conditions. Confirm that the FGG484 package type matches the PCB footprint requirements. Ensure power supply rails meet the recommended DC voltage tolerances specified in Table 3-2 to maintain functional reliability.

Soc System On Chip Selection Notes

Select this component when a combined MCU and FPGA solution is needed within a 6K LE density constraint. Compare thermal resistance values from Table 3-7 against the expected system power dissipation to determine if heatsinking or airflow is necessary. Verify that the available embedded memory meets the data retention and programming cycle requirements for the target application lifecycle.

Soc System On Chip Part Context

This part belongs to the SmartFusion 2 family, which combines low-power flash FPGA technology with a hard ARM Cortex-M3 core. It is distinct from the IGLOO 2 family by its inclusion of the MSS peripheral set. The '005S' designation indicates the 6K LE density with data security features, while 'FGG484' specifies the 484-ball FineLine BGA package.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package are limited to other densities in the SmartFusion 2 series (e.g., M2S010S-FGG484I). Cross-family migration to IGLOO 2 requires significant schematic and firmware changes due to the absence of the MSS. Always consult the latest device errata for known silicon revisions.