M2S010-1TQG144I

Soc System On Chip Overview

The M2S010-1TQG144I is a SmartFusion 2 System-on-Chip FPGA featuring an ARM Cortex-M3 processor and approximately 10,000 logic elements. It integrates low-power flash technology for non-volatile configuration storage. The device supports industrial operating temperatures ranging from -40°C to +100°C. Electrical specifications include a core supply voltage (VDD) of 1.14V to 1.26V and I/O bank voltages supporting standards from 1.2V to 3.3V. The package is a 144-pin Thin Quad Flatpack with a 0.5mm pitch.

Soc System On Chip Feature Summary

• Integrates an ARM Cortex-M3 Microcontroller Subsystem with embedded peripherals including Ethernet, USB, and CAN controllers.
• Features a 4-input LookUp Table (LUT) based FPGA fabric with approximately 10K logic elements and embedded memory blocks.
• Utilizes low-power flash technology providing secure, non-volatile configuration without external boot devices.
• Supports high-performance SerDes communication interfaces and hard DDR3 memory controllers with error correction.

Soc System On Chip Applications

• Industrial automation systems requiring real-time control and secure data logging.
• Embedded networking equipment utilizing integrated Ethernet MAC capabilities.
• Automotive applications needing robust MCU/FPGA integration within specified temperature ranges.
• Secure IoT gateways leveraging on-chip cryptographic blocks and flash-based security features.

Soc System On Chip Procurement Notes

Verify the specific suffix '1' indicates the industrial temperature grade (-40°C to +100°C) and 'TQ' denotes the TQFP-144 package. Confirm that the datasheet DS00004750 applies to the M2S010 density class. Ensure power supply rails meet the recommended operating conditions for VDD and VPP before ordering.

Soc System On Chip Selection Notes

Select this component when both programmable logic fabric and a hardened ARM Cortex-M3 processor are required in a single chip. Consider the 10K logic element density against application complexity. Verify thermal requirements as junction temperature impacts maximum power dissipation. Ensure design tools support the SmartFusion 2 family architecture.

Soc System On Chip Part Context

This part belongs to the SmartFusion 2 SoC FPGA family, which combines FPGA fabric with a microcontroller subsystem. It shares architectural similarities with IGLOO 2 FPGAs but includes the additional MSS. The M2S010 represents the mid-range density option within this series, offering a balance between logic capacity and power consumption.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout include other M2S010 variants with different temperature grades or package types, such as M2S010-TQ144I for commercial grade. Cross-family migration to IGLOO 2 requires removing the MSS components from the design. Verify pin compatibility if substituting with higher density parts like M2S025.