M2S150-FCS536I

Soc System On Chip Overview

The M2S150-FCS536I is a SmartFusion® 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM® Cortex®-M3 processor with a 150K logic element FPGA fabric, operating at speeds up to 166MHz. The device features 512KB of flash memory and 64KB of RAM within the Microcontroller Subsystem (MSS). It supports high-speed peripherals including DDR, PCIe, and SERDES interfaces, alongside standard connectivity options like Ethernet, USB, CANbus, I2C, SPI, and UART/USART. The component is housed in a 536-CSPBGA package with 293 I/Os.

Soc System On Chip Feature Summary

• Integrates ARM® Cortex®-M3 MCU with 150K Logic Elements
• Includes 512KB Flash and 64KB RAM in MSS
• Supports DDR, PCIe Gen 2, and SERDES interfaces
• Provides extensive connectivity: Ethernet, USB, CANbus, I2C, SPI, UART

Soc System On Chip Applications

• Industrial control systems requiring mixed-signal processing
• Automotive infotainment and gateway applications
• Secure communication infrastructure devices
• Test and measurement equipment

Soc System On Chip Procurement Notes

Verify the specific temperature grade suffix for the required operating range. Industrial grade parts include a 'T' in the part number (e.g., M2S150T), while commercial grade parts do not. Confirm RoHS compliance status as it varies by temperature grade; industrial versions may differ from commercial specifications regarding environmental standards. Ensure the correct package variant matches the PCB footprint requirements.

Soc System On Chip Selection Notes

Select the M2S150T variant for industrial applications requiring operation between -40°C and 100°C junction temperature. Use the standard M2S150 for commercial environments limited to 0°C to 85°C. Both variants share identical electrical characteristics and pinouts but differ in thermal endurance and qualification standards. Verify that the 536-ball CSPBGA package fits the design constraints, as it requires specific layout guidelines for signal integrity and thermal dissipation.

Soc System On Chip Part Context

This component belongs to the SmartFusion® 2 family, which combines low-power flash FPGA technology with a hardened ARM Cortex-M3 subsystem. It is designed for applications needing secure, reliable, and low-power embedded solutions. The M2S150 density offers a balance between logic capacity and power consumption, suitable for complex system integration without the overhead of larger FPGA families.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and functionality are limited to other densities in the SmartFusion 2 series, such as M2S090 or M2S060, if lower logic resources suffice. Cross-family migration to IGLOO 2 is possible for FPGA-only needs but lacks the integrated MCU. Verify pin compatibility and software toolchain support when considering alternative densities.