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M50-3113942 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN RCPT 78POS 0.05 GOLD SMD. Review the specifications below when checking this part for your BOM.
The M50-3113942 is a 78-position receptacle connector from the Harwin Archer M50 series. It features a 1.27 mm (0.05 in) pitch and utilizes surface mount termination for PCB integration. The connector employs gold-plated contacts to ensure reliable signal transmission. Designed for high-density applications, it supports a current rating of 1 A per contact. The housing is constructed from thermoplastic material, providing structural integrity and insulation.
Verify component availability status as this part number may be subject to discontinuation or limited stock. Confirm RoHS compliance documentation prior to order placement. Ensure procurement channels are authorized distributors to guarantee authenticity. Cross-reference datasheet revisions to match specific manufacturing batches. Validate packaging specifications against production requirements.
Select this component for applications requiring high pin counts in compact surface mount footprints. Evaluate thermal management capabilities given the 1 A current rating. Consider mating connector compatibility within the Archer M50 family. Assess mechanical retention needs for surface mount reliability. Verify operating temperature range suitability for the target environment.
This connector belongs to the Archer M50 series, characterized by a 1.27 mm pitch and robust construction. The series offers various configurations including headers and receptacles. The M50-3113942 specifically addresses high-density socket requirements. It complements male header counterparts within the same ecosystem. The design prioritizes space efficiency and electrical performance.
Public records indicate this product is no longer manufactured. No direct public substitute part numbers are confirmed. Engineers should consult official Harwin documentation for legacy replacement strategies. Alternative solutions may require redesigning the footprint.
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