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M55-6101642R is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN RCPT 16P 0.05 GOLD SMD R/A. Review the specifications below when checking this part for your BOM.
The Harwin M55-6101642R is a board-to-board and mezzanine connector from the Archer Kontrol series. It features a 1.27 mm pitch with 16 positions arranged in two rows. The component utilizes a right-angle surface mount technology (SMT) termination style. Electrical ratings include a current capacity of 1.2 A and a voltage rating of 100 VAC. The operating temperature range spans from -55°C to +125°C. Contact materials consist of phosphor bronze with gold plating, while the housing is constructed from liquid crystal polymer (LCP).
Verify the specific suffix codes against official Harwin documentation to confirm orientation and contact configuration. Ensure compatibility with mating header components within the same Archer Kontrol series. Confirm RoHS compliance status through the manufacturer's latest environmental declarations before finalizing procurement specifications.
Select this model for applications necessitating a right-angle footprint to optimize board density. The 1.27 mm pitch supports moderate pin counts within limited areas. Verify that the 1.2 A current rating aligns with circuit requirements. Consider the mounting peg style for precise alignment during automated assembly processes.
This component belongs to the Harwin Archer Kontrol M55 series, designed for harsh environments. The series offers various pitch options and configurations for board-to-board and wire-to-board connections. The M55-6101642R specifically addresses needs for robust, high-density interconnects in industrial and aerospace sectors.
Direct substitutes must match the 1.27 mm pitch, 16-position count, right-angle orientation, and SMT termination. Verify identical electrical ratings and housing material properties. Cross-reference mating part numbers to ensure mechanical and electrical compatibility within the system architecture.
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