M81705FP

Full Half-Bridge (H Bridge) Drivers Overview

The M81705FP is a high-voltage integrated circuit (HVIC) half-bridge driver manufactured by Powerex Inc. It operates within a junction temperature range of -20°C to 125°C and is housed in an 8-SOP surface-mount package with a width of 4.40mm. The device is rated for 600V and supports gate drive currents between 125mA and 150mA, enabling efficient control of AC loads, incandescent bulbs, and general-purpose power MOSFETs.

Full Half-Bridge (H Bridge) Drivers Feature Summary

• Designed as a half-bridge driver for high-voltage applications
• Supports floating supply voltage configurations
• Optimized for driving power MOSFETs and IGBT modules

Full Half-Bridge (H Bridge) Drivers Applications

• Control of AC loads
• Incandescent bulb drivers
• General-purpose power MOSFET switching

Full Half-Bridge (H Bridge) Drivers Procurement Notes

Verify the manufacturer origin carefully, as datasheets may reference Mitsubishi Electric Semiconductor while distributors list Powerex Inc. Confirm the specific package variant matches the 8-SOP requirement. Ensure the component meets RoHS compliance standards if required by your assembly process. Cross-reference the supplier's part number against official distributor listings to avoid counterfeit or obsolete stock.

Full Half-Bridge (H Bridge) Drivers Selection Notes

Select this component when a robust half-bridge solution is needed for 600V systems. The 8-SOP package suits space-constrained surface-mount designs. Consider the 125-150mA drive current capability for matching load requirements. Verify thermal management needs given the 125°C maximum junction temperature rating for reliable operation in demanding environments.

Full Half-Bridge (H Bridge) Drivers Part Context

This component belongs to the M8170x series of high-voltage IC drivers from Powerex Inc., which also includes variants like the M81706AFP and M81707FP. These devices are engineered for power management applications requiring isolated or floating gate drive capabilities. The series supports various package options to accommodate different board layout constraints and thermal dissipation needs.

Full Half-Bridge (H Bridge) Drivers Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.