MC7447AHX600NB

Microprocessors Overview

The MC7447AHX600NB is a microprocessor from the MPC7447A series, manufactured by NXP Semiconductors. It features an e600 core with a maximum clock frequency of 600 MHz and a 32-bit data bus width. The device operates at a supply voltage of 1.1 V and supports I/O voltages of 1.8 V and 2.5 V. It includes 32 kB L1 instruction cache, 32 kB L1 data cache, and 512 kB L2 cache. The processor is housed in an HCTE-BGA-360 package and is rated for an operating temperature range of 0°C to +105°C.

Microprocessors Feature Summary

• Implements the PowerPC 32-bit RISC architecture with floating-point capabilities.
• Integrates L1 and L2 cache memory structures for data and instruction storage.
• Supports surface mount installation via a BGA package format.

Microprocessors Applications

• Automotive electronic control units requiring AEC-Q100 qualification.
• Embedded systems utilizing PowerPC G4 compatible architectures.
• Industrial applications demanding extended temperature operation ranges.

Microprocessors Procurement Notes

Verify component authenticity through authorized channels as this part is obsolete. Confirm package integrity and pin compatibility during replacement planning. Check for RoHS compliance status updates if required for specific regulatory environments. Ensure design-in documentation matches the exact suffix specifications for thermal and electrical characteristics.

Microprocessors Selection Notes

Select this component for designs requiring a single-core 32-bit processor with integrated cache. Consider the 600 MHz performance tier relative to other MPC7447 variants. Evaluate the HCTE-BGA-360 footprint against available PCB space. Verify power supply requirements align with the 1.1 V core and 1.8/2.5 V I/O specifications.

Microprocessors Part Context

This microprocessor belongs to the MPC74xx family, implementing the PowerPC architecture. It serves as a high-performance embedded solution for automotive and industrial markets. The device integrates essential processing elements within a compact ball grid array package suitable for dense board layouts.

Microprocessors Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.