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MC74AC540N is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFF INVERT 6V 20DIP. Review the specifications below when checking this part for your BOM.
The MC74AC540N is an octal buffer and line driver manufactured by onsemi, belonging to the 74AC logic family. It features eight inverting outputs with three-state capability, housed in a 20-pin DIP package. The device operates within a supply voltage range of 2.0 V to 6.0 V. At 3.3 V, propagation delay ranges from 1.5 ns to 7.5 ns; at 5.0 V, it ranges from 1.5 ns to 6.0 ns. Outputs source and sink up to 24 mA. Quiescent supply current is typically 8 µA, rising to a maximum of 80 µA across the industrial temperature range of -40°C to +85°C.
Verify that the ordering suffix 'N' corresponds to the PDIP-20 package variant, as datasheet ordering tables primarily list SOIC and TSSOP options. Confirm RoHS compliance status and moisture sensitivity level requirements for your specific assembly process. Ensure the component meets the required operating temperature range and voltage specifications before finalizing procurement.
Select this component when an octal inverting buffer with high drive strength is required. The flow-through pinout is advantageous for dense PCB layouts involving microprocessors. Consider the MC74AC541 if non-inverting functionality is needed instead. Verify that the AC logic speed and voltage compatibility match the system requirements compared to ACT variants.
This device is part of the MC74AC540/541 series of octal buffers and line drivers. It shares functional similarities with the MC74AC240 and MC74AC244 but utilizes a distinct flow-through pin configuration. The series includes both inverting (540) and non-inverting (541) options, catering to various digital signal routing needs in memory and bus applications.
MC74AC541DWG
The MC74AC540 provides inverted outputs, meaning the output state is the logical complement of the input state.
The inputs and outputs are located on opposite sides of the package, facilitating easier interface to microprocessors and allowing for greater printed circuit board density.
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