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Product Detailed Parameters
- Description:SCR MODULE 1.2KV 85A TO240AA
- Series:-
- Mfr:IXYS
- Package:Box
- Structure:Series Connection - SCR/Diode
- Number of SCRs, Diodes:1 SCR, 1 Diode
- Voltage - Off State:1.2 kV
- Current - On State (It (AV)) (Max):85 A
- Current - On State (It (RMS)) (Max):135 A
- Current - Non Rep. Surge 50, 60Hz (Itsm):1500A, 1620A
- Operating Temperature:-40°C ~ 140°C (TJ)
- Mounting Type:Chassis Mount
- Package / Case:TO-240AA
- Voltage - Gate Trigger (Vgt) (Max):1.5 V
- Current - Gate Trigger (Igt) (Max):95 mA
- Current - Hold (Ih) (Max):200 mA
- Grade:-
- Qualification:-
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Overview
The MCMA85PD1200TB is a silicon SCR module from the IXYS MCMA series, designed for line frequency applications. It utilizes planar passivated chips and direct copper bonding to an aluminum oxide substrate. The device features a thyristor configuration with a peak repetitive off-state voltage of 1200 V and an on-state RMS current rating of 85 A. It is housed in a bulk package suitable for industrial power conversion systems.
Feature Summary
- Utilizes planar passivated chip technology for enhanced reliability
- Features direct copper bonding to an aluminum oxide substrate for efficient thermal management
- Designed specifically for line frequency operation
Applications
- Industrial motor drives
- Power supply units
- Welding equipment
Procurement Notes
Verify the specific suffix 'TB' against the manufacturer's official datasheet to confirm exact pinout and mechanical dimensions. Ensure the selected variant matches the required thermal interface specifications for the intended heatsink application before finalizing procurement.
Selection Notes
Select this component when a robust thyristor solution is needed for high-current line frequency circuits. The 85 A rating and 1200 V blocking capability make it suitable for medium-power industrial applications requiring reliable phase control or rectification.
Part Context
This part belongs to the MCMA family of SCR modules from IXYS. These modules are characterized by their use of planar passivated chips and direct copper bonding to aluminum oxide substrates, providing a durable solution for demanding power electronics environments.
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