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MF3D2201DUF/01V is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MIFARE DESFIRE EV2 MULTI APP. Review the specifications below when checking this part for your BOM.
The MF3D2201DUF/01 is a contactless multi-application IC from the MIFARE DESFire EV2 family, manufactured by NXP Semiconductors. It features 2 kbit of non-volatile memory and operates at 13.56 MHz compliant with ISO/IEC 14443 Type A. The device includes a hardware cryptographic engine supporting AES-128 and 3DES, achieving Common Criteria EAL5+ certification. It utilizes an FFC 8-inch wafer sawn die package with a 75 μm thickness and a typical input capacitance of 17 pF.
Verify that the specific suffix /01 corresponds to the required wafer format and thickness specifications. Confirm that the 17 pF input capacitance aligns with the antenna design requirements for the target application. Ensure compatibility with existing reader infrastructure supporting ISO/IEC 14443 Type A protocols.
Select this component when high security (EAL5+) and flexible multi-application support are required. The 2 kbit capacity suits applications needing moderate data storage. Choose the 'D' variant over 'DH' if the design requires lower input capacitance (17 pF) rather than the higher capacitance option (70 pF) available in the DH series.
This part belongs to the MF3D(H)x2 series, representing the third generation of MIFARE DESFire products. It succeeds the MIFARE DESFire EV1 and D40 models, offering backward compatibility while introducing new security features like Virtual Card Architecture and enhanced secure messaging based on AES.
Functionally backward compatible with MIFARE DESFire EV1 (MF3Dx1) and MIFARE DESFire D40 (MF3ICD40). For direct upgrades within the same family, consider MF3D4201DUF/01 for 4 kbit capacity or MF3D8201DUF/01 for 8 kbit capacity, maintaining the same package and capacitance characteristics.
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