MPFS160TL-FCSG536I

Soc System On Chip Overview

The MPFS160TL-FCSG536I is a PolarFire SoC FPGA manufactured by Microchip Technology, featuring an integrated RISC-V processor and programmable logic fabric. It utilizes a 536-ball LFBGA package for surface mount installation. The device supports a maximum clock frequency of 667 MHz and contains 161,000 logic elements. Embedded memory capacity reaches 11.3 Mbit. Operating voltage ranges from 970 mV to 1.08 V across different domains. The component functions within a temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

• Integrated RISC-V CPU core with up to 667 MHz operation
• 161K logic elements for complex digital design implementation
• 11.3 Mbit embedded memory for data storage and processing
• 536-ball LFBGA package suitable for high-density PCB layouts

Soc System On Chip Applications

• Industrial automation control systems
• Telecommunications infrastructure equipment
• Automotive electronic control units
• Medical imaging devices requiring low power consumption

Soc System On Chip Procurement Notes

Verify the specific suffix 'L' against official Microchip documentation to confirm any distinct electrical or mechanical variations compared to standard variants. Ensure compatibility with existing board designs regarding pinout and thermal requirements before procurement.

Soc System On Chip Selection Notes

Select this model when a balance between moderate logic density and low static power consumption is required. The inclusion of an on-chip RISC-V processor allows for system-level integration, reducing the need for external microcontrollers in embedded applications.

Soc System On Chip Part Context

This part belongs to the PolarFire SoC family, designed for secure, low-power edge computing. It combines Flash-based FPGA technology with a hardened processor subsystem, offering non-volatile configuration and robust performance in harsh environments.

Soc System On Chip Replacement Considerations

Direct substitutes may include other MPFS160 variants with compatible packages. Verify pin-to-pin compatibility and electrical specifications before replacing components in existing assemblies.