MS21SF1-3N62AIR

RF Transceiver Modules And Modems Overview

The MS21SF1-3N62AIR is a low-power, long-range LoRa transceiver module based on the Semtech SX1262 chip. It supports global ISM frequencies including 868MHz and 915MHz. The module features a compact SPI interface and U.FL antenna connector. In receive mode, it consumes only 4.7mA of current. It supports FSK, GFSK, and LoRa modulation for half-duplex communication.

RF Transceiver Modules And Modems Feature Summary

• Supports FSK, GFSK, and LoRa modulation modes
• Ultra-low power consumption in receive mode
• Compact design with SPI interface
• Long-range wireless communication capability

RF Transceiver Modules And Modems Applications

• IoT sensor networks
• Smart metering systems
• Industrial monitoring
• Wireless telemetry

RF Transceiver Modules And Modems Procurement Notes

Verify the specific frequency band configuration (868MHz or 915MHz) matches regional regulatory requirements. Confirm the U.FL antenna connector type is compatible with your system design. Ensure the SX1262-based module meets your power consumption constraints for battery-operated applications.

RF Transceiver Modules And Modems Selection Notes

Select this module when long-range communication and low power consumption are critical. The SX1262 chip offers high sensitivity and robust performance. Consider the U.FL connector for antenna integration. Verify frequency band compliance for your target market before implementation.

RF Transceiver Modules And Modems Part Context

The MS21SF1 series includes variants like MS21SF1-3N68AIR for different frequency bands. All variants share the same core SX1262 technology and modular design. The -3N62AIR suffix typically denotes the 868MHz/915MHz ISM band configuration.

RF Transceiver Modules And Modems Replacement Considerations

Direct substitutes include other MinewSemi modules using the SX1262 chip, such as the MS21SF1-3N68AIR for alternative frequency bands. Cross-compatibility depends on frequency band requirements and antenna interface specifications.