MSMP157-BAA

Microcontrollers, Microprocessor, FPGA Modules Overview

The ARIES Embedded MSMP157-BAA is an Open Standard Module (OSM) compliant System-in-Package based on the STMicroelectronics STM32MP157 microprocessor. It integrates a dual-core Arm Cortex-A7 running up to 800 MHz and a Cortex-M4 core at 209 MHz, alongside a 3D GPU. The module features 1 GB of DDR3L RAM and 4 GB of eMMC NAND flash, complemented by 128 MBit SPI-NOR flash. Connectivity includes Gigabit Ethernet, USB 2.0 Host/OTG, dual CAN FD interfaces, and multiple display options such as MIPI-DSI and parallel LCD-TFT. It operates in a commercial temperature range of 0°C to +70°C.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• STM32MP157 processor with Dual Cortex-A7 (up to 800 MHz) and Cortex-M4 (up to 209 MHz)
• 1 GB DDR3L RAM and 4 GB eMMC storage
• Compliant with SGET OSM Size M standard (30x45 mm, 476 contacts)
• Integrated STPMIC1 PMIC supporting 3.3V I/O voltage

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial IoT gateways requiring deterministic real-time processing
• Smart city infrastructure and smart home control systems
• Medical and healthcare equipment with embedded Linux capabilities
• Graphical user interface (GUI) displays utilizing the 3D OpenGL ES 2.0 engine

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific PMIC variant during ordering, as the MSMP157-BAA supports either 1.8V or 3.3V I/O voltages depending on the installed STPMIC1A or STPMIC1B component. Confirm that the baseboard design adheres to the OSM Size M mechanical specifications and utilizes ENIG-LGA contact pads for proper soldering. Ensure moisture-sensitive handling protocols are followed, storing the module in vacuum packages with dry packs until assembly.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select the MSMP157-BAA when high-performance application processing is required alongside real-time control tasks. This configuration provides 1 GB of RAM and 4 GB of eMMC, suitable for complex operating systems like Linux. Choose this model over variants with lower memory capacities if the target application demands extensive multitasking or large graphical assets. Verify that the carrier board supports the 3.3V I/O level associated with the standard STPMIC1A derivative.

Microcontrollers, Microprocessor, FPGA Modules Part Context

The MSMP157-BAA belongs to the MSMP1 series of Open Standard Modules developed by ARIES Embedded GmbH. These modules are designed to provide a cost-efficient PCB architecture by combining the STM32MP1 family's flexibility with standardized modular interfaces. The series allows developers to accelerate product development by using validated hardware components and open-source software stacks, ensuring long-term availability and ecosystem support.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacement requires matching the OSM Size M form factor (30x45 mm) and 476-contact LGA interface. Alternative configurations within the MSMP1 series, such as those with different RAM or flash capacities, may be compatible if electrical requirements align. Ensure the replacement unit matches the I/O voltage specification (1.8V vs 3.3V) determined by the PMIC variant.