MT30AZZZDDB0TPWL-031 W.19R

Memory IC Overview

The MT30AZZZDDB0TPWL-031 W.19R is a UFS-based Multichip Package (uMCP) manufactured by Micron Technology. It integrates NAND flash and LPDDR5 memory within a single TFBGA-297 package. The component offers a total storage capacity of 4192 Gbit, combining 4Tbit of NAND flash with 64 Gbit of LPDDR5 RAM. It operates at a voltage of 1.2 VOLTS and utilizes SMD/SMT mounting styles for surface mount applications.

Memory IC Feature Summary

• Integrates high-density NAND flash and LPDDR5 DRAM in a compact multichip package
• Supports Ultra Fast Storage (UFS) interface standards for mobile devices
• Designed to minimize power consumption while maximizing data density and speed

Memory IC Applications

• Smartphones and tablets requiring high-performance mobile storage
• Wearable technology with space-constrained form factors
• IoT devices needing integrated non-volatile and volatile memory solutions

Memory IC Procurement Notes

Verify current availability status as the part may be obsolete or subject to limited supply. Confirm RoHS compliance and toxic substance declarations via official Micron documentation before integration. Ensure compatibility with existing PCB layouts for TFBGA-297 packages. Contact authorized distributors for accurate lead times and stock levels, as inventory data fluctuates frequently.

Memory IC Selection Notes

Select this component when a unified solution for both persistent storage and high-speed working memory is required. The uMCP format reduces board space compared to discrete components. Ensure the host system supports UFS protocols and LPDDR5 interfaces. Verify thermal management capabilities for the specific application environment given the integrated nature of the chips.

Memory IC Part Context

This part belongs to Micron's UFS-based MCP family, designed for mobile electronics. It represents an evolution in memory integration, moving towards higher densities and improved power efficiency. The product line targets the smartphone market where size and performance are critical constraints. Similar parts in the catalog vary primarily in capacity and generation specifications.

Memory IC Replacement Considerations

Check for direct substitutes within the MT30AZ series with compatible pinouts and electrical characteristics. Verify if newer revisions offer equivalent or improved performance metrics. Ensure any replacement maintains the same TFBGA-297 footprint and UFS/LPDDR5 interface requirements.