Memory IC MT53B256M32D1GZ-062 WT:B product image

MT53B256M32D1GZ-062 WT:B

  • Description:IC DRAM 8GBIT 1.6GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:c9de20c6319c Category: Brand:

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MT53B256M32D1GZ-062 WT:B is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 8GBIT 1.6GHZ 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53B256M32D1GZ-062 WT:B

  • Description:IC DRAM 8GBIT 1.6GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:8Gbit
  • Memory Organization:256M x 32
  • Memory Interface:-
  • Clock Frequency:1.6 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-WFBGA
  • Supplier Device Package:200-WFBGA (11x14.5)
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT53B256M32D1GZ-062 WT:B

MT53B256M32D1GZ-062 WT:B

Memory IC Overview

The MT53B256M32D1GZ-062 WT:B is a mobile LPDDR4 SDRAM memory IC manufactured by Micron Technology. It features an 8 Gbit storage capacity organized as 256M x 32 bits. The device supports a maximum clock frequency of 1.6 GHz and operates at a maximum supply voltage of 1.1 V. It is housed in a 200-WFBGA package measuring 11x14.5 mm. The component is rated for commercial temperature ranges, typically spanning from -25°C to +85°C.

Memory IC Feature Summary

  • Mobile LPDDR4 architecture optimized for high-performance embedded systems
  • High-speed data processing capability with 1.6 GHz clock frequency
  • Low voltage operation for improved power efficiency
  • Compact 200-pin WFBGA footprint suitable for space-constrained designs

Memory IC Applications

  • Automotive infotainment and telematics systems
  • Smartphones and mobile communication devices
  • Tablets and portable computing devices
  • Wearable technology and IoT edge devices

Memory IC Procurement Notes

Verify the specific suffix (WT:B) against official Micron documentation to confirm temperature grade and packaging details. Ensure compatibility with system power management requirements for LPDDR4 interfaces. Confirm availability status directly with authorized distributors as stock levels fluctuate. Validate that the 200-WFBGA footprint matches the target PCB design constraints.

Memory IC Selection Notes

Select this component when designing mobile or automotive applications requiring high bandwidth within a small form factor. The 8 Gbit density provides sufficient memory for complex operating systems and multimedia tasks. Consider the 1.6 GHz speed for latency-sensitive workloads. Ensure the host controller supports LPDDR4 signaling standards and voltage levels.

Memory IC Part Context

This part belongs to Micron's MT53B series of mobile LPDDR4 DRAMs. These components are engineered to balance performance, power consumption, and physical size. The series targets next-generation mobile platforms where energy efficiency and data throughput are critical design parameters.

Memory IC Replacement Considerations

Check for direct substitutes such as the MT53B256M32D1GZ-062 AIT:B variant, which offers an extended industrial temperature range. Verify pinout and electrical specifications before swapping to ensure system compatibility.

MT53B256M32D1GZ-062 WT:BMT53B256M32D1GZ-062 WT:B

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