Memory IC MT53D512M32D2DS-046 AAT:D product image

MT53D512M32D2DS-046 AAT:D

  • Description:IC DRAM 16GBIT 2.133GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:7c97dfd2707a Category: Brand:

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MT53D512M32D2DS-046 AAT:D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT 2.133GHZ 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53D512M32D2DS-046 AAT:D

  • Description:IC DRAM 16GBIT 2.133GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:16Gbit
  • Memory Organization:512M x 32
  • Memory Interface:-
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-WFBGA
  • Supplier Device Package:200-WFBGA (10x14.5)
  • Grade:Automotive
  • Qualification:AEC-Q100

Memory IC datasheet and documents for MT53D512M32D2DS-046 AAT:D

MT53D512M32D2DS-046 AAT:D

Memory IC Overview

The Micron MT53D512M32D2DS-046 AAT:D is a 16 Gbit LPDDR4 SDRAM component organized as 512 Meg x 32. It operates with a maximum clock frequency of 2.133 GHz and features a WFBGA-200 package. The device supports a data bus width of 32 bits and has an access time of 3.5 ns. Operating voltage ranges from 1.06 V to 1.95 V, with a minimum operating temperature of -40°C and a maximum of +105°C.

Memory IC Feature Summary

  • Supports low voltage core and I/O power supplies for energy efficiency
  • Features 16n prefetch DDR architecture for high bandwidth performance
  • Includes eight internal banks per channel for concurrent operations

Memory IC Applications

  • Mobile computing platforms requiring high memory density
  • Smartphones and tablets utilizing LPDDR4 technology
  • Embedded systems demanding extended industrial temperature ranges

Memory IC Procurement Notes

Verify the specific suffix AAT:D against official Micron documentation to confirm exact speed bin and temperature grade specifications. Ensure compatibility with system power delivery requirements for the specified voltage range. Confirm package dimensions match the target PCB footprint before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 16 Gbit capacity with a 32-bit interface is required for mobile or embedded applications. The WFBGA-200 package offers a compact form factor suitable for space-constrained designs. Verify that the host controller supports LPDDR4 signaling standards and the required 2.133 GHz clock speeds for optimal performance.

Memory IC Part Context

This part belongs to Micron's LPDDR4 SDRAM family, designed for mobile and embedded markets. It provides significant bandwidth improvements over previous generations while maintaining lower power consumption. The 16 Gbit density allows for substantial memory expansion in portable devices without increasing board space significantly.

Memory IC Replacement Considerations

Micron recommends the MT53E512M32D1ZW-046 WT:B as a manufacturer-recommended alternative. Verify pinout and electrical parameter compatibility before substitution.

MT53D512M32D2DS-046 AAT:DMT53D512M32D2DS-046 AAT:D

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