Memory IC MT53D512M32D2DS-046 WT:D TR product image

MT53D512M32D2DS-046 WT:D TR

$13.12
  • Description:IC DRAM 16GBIT 2.133GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:06e7de097225 Category: Brand:

  
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MT53D512M32D2DS-046 WT:D TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT 2.133GHZ 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53D512M32D2DS-046 WT:D TR

  • Description:IC DRAM 16GBIT 2.133GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:16Gbit
  • Memory Organization:512M x 32
  • Memory Interface:-
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-WFBGA
  • Supplier Device Package:200-WFBGA (10x14.5)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT53D512M32D2DS-046 WT:D TR

MT53D512M32D2DS-046 WT:D TR

Memory IC Overview

The Micron MT53D512M32D2DS-046 WT:D TR is a 16 Gbit LPDDR4 SDRAM component organized as 512 Megabits by 32 bits. It utilizes a VFBGA-200 package with surface mount technology. The device supports data rates ranging from 4266 to 20 Mb/s per pin, corresponding to clock frequencies between 2133 MHz and 10 MHz. Core voltage specifications include VDD1 at 1.70V to 1.95V (nominal 1.80V), VDD2 at 1.06V to 1.17V (nominal 1.10V), and VDDQ at 1.10V nominal or low VDDQ at 0.57V to 0.65V (nominal 0.60V). Operating temperature ranges from -30°C to +85°C.

Memory IC Feature Summary

  • Features a 16n pre-fetch DDR architecture for efficient data transfer.
  • Includes eight internal banks per channel to enable concurrent operations.
  • Supports ultra-low voltage core and I/O power supply configurations.

Memory IC Applications

  • Mobile devices requiring high-density memory
  • Embedded systems utilizing LPDDR4 interfaces
  • Industrial IoT solutions

Memory IC Procurement Notes

Verify the current lifecycle status directly with the manufacturer, as availability information may be incomplete. Confirm that the specific suffix corresponds to the required packaging format, such as reel or cut tape, before finalizing orders. Ensure compatibility with host system voltage requirements and thermal constraints during the design phase.

Memory IC Selection Notes

Select this component when a 16 Gbit capacity with a 32-bit bus width is required in a compact VFBGA-200 footprint. Consider the specific operating voltage range and data rate capabilities to match the target application's performance needs. Verify that the industrial temperature range meets the environmental conditions of the intended deployment scenario.

Memory IC Part Context

This part belongs to the Micron MT53D series of mobile LPDDR4 SDRAM products. It is designed to provide high bandwidth and density for mobile and embedded applications. The component integrates advanced features such as ZQ calibration and automatic self-refresh to maintain reliability and efficiency in portable electronic devices.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult official cross-reference tools or manufacturer guidelines for potential alternatives if this specific part number is unavailable.

Memory IC FAQ

What is the organization of the MT53D512M32D2DS-046?

The component is organized as 512 Megabits by 32 bits.

Does the device support low VDDQ operation?

Yes, it supports low VDDQ operation with a nominal voltage of 0.60V, ranging from 0.57V to 0.65V.

MT53D512M32D2DS-046 WT:D TRMT53D512M32D2DS-046 WT:D TR
$13.12
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